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| Product Offerings |
| Sil-Pad; Thermally Conductive Interface Materials, Bond Ply & Liqui-bond; Thermally Conductive Adhesives, Gap pads; Thermally Conductive Gap Filling Materials, Hi-Flow; Phase Change Interface Materials, TIC; Thermal Interface Compounds, Thermal Clad; PCB with Insulated Metal Substrates. |
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| Sales and Service |
| 602-678-1955 |
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| Distribution |
| Components Center / Dalis |
(602) 275-2626 |
| Digi-key |
(800) 344-4539 |
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